Radiation Hardening of Non-Hardened Commercial Microelectronics
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Summary
The Missile Defense Agency seeks proposals to develop a process that radiation hardens commercial microelectronics using advanced packaging and chiplet integration, targeting specific single‑event latch‑up immunity and total ionizing dose survivability for space systems. The effort focuses on adapting state‑of‑the‑art COTS components such as sub‑16nm FinFETs or Gate All Around devices to meet stringent radiation requirements without redesigning the underlying silicon.