Low-cost Mid-wave Infrared Focal-Plane Array (FPA) Fabrication through Direct-bond Interconnection
Summary
The Department of War Navy Office of Naval Research seeks proposals to develop a low‑cost mid‑wave infrared focal‑plane array (MWIR FPA) fabrication process using direct‑bond interconnection (DBI) to replace traditional indium bump‑bonding. The effort aims to enable large‑format, small‑pixel MWIR sensors for applications such as border security and industrial monitoring, potentially advancing broader micro‑electronic technologies.