In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
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Summary
The Department of War seeks proposals to develop a non‑destructive, in‑situ metrology tool that can screen full‑wafer infrared detector arrays for surface damage and current defects during fabrication of small‑pixel focal plane arrays. This capability is critical for maintaining high yield and low noise performance of advanced sensor platforms across ground, air, maritime, and space domains.