Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging
This solicitation's response window has closed.
Summary
The Department of War, Office of the Secretary of Defense seeks proposals to model, design, and produce a co‑packaged digital readout integrated circuit with photonic output for high‑speed infrared sensor demonstrations in cryogenic environments. This effort targets a paradigm shift in infrared focal plane array bandwidth and power consumption by integrating electronics and photonics on a single silicon wafer, which is central to advanced microelectronics and sensing capabilities.