Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)
Summary
DARPA seeks proposals to develop and demonstrate novel hard‑mask materials that provide substantially improved plasma etch resistance for extreme high‑aspect‑ratio nanofabrication. The effort targets next‑generation defense‑relevant microsystems such as 3D ICs, MEMS sensors, photonic devices, and quantum platforms where current mask technologies limit performance.